? semiconductor components industries, llc, 2009 october, 2009 ? rev. 1 1 publication order number: nbxdpa012/d nbxdpa012 2.5 v / 3.3 v, 106.25 mhz / 212.5mhz lvds clock oscillator the nbxdpa012 dual frequency crystal oscillator (xo) is designed to meet today?s requirements for 2.5 v and 3.3 v lvds clock generation applications. the device uses a high q fundamental crystal and phase lock loop (pll) multiplier to provide selectable 106.25 mhz or 212.5 mhz, ultra low jitter and phase noise lvds differential output. this device is a member of on semiconductor?s pureedge clock family that provides accurate and precision clock solutions. available in 5 mm x 7 mm smd (clcc) package on 16 mm tape and reel in quantities of 1000. features ? lvds differential output ? uses high q fundamental mode crystal and pll multiplier ? ultra low jitter and phase noise ? 0.4 ps (12 khz ? 20 mhz) ? selectable output frequency ? 106.25 mhz (default) / 212.5 mhz ? hermetically sealed ceramic smd package ? rohs compliant ? operating range: 2.5 v 5% operating range: 3.3 v 10% ? total frequency stability ? 50 ppm ? this is a pb ? free device applications ? 1x and 2x fiber channel ? host bus adapter figure 1. simplified logic diagram pll clock multiplier crystal gnd fsel oe clk clk v dd 654 123 http://onsemi.com device package shipping ? ordering information ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. NBXDPA012LN1TAG clcc ? 6 (pb ? free) 1000/ tape & reel marking diagram nbxdpa012 = nbxdpa012 ( 50 ppm) 106.25/212.5 = output frequency (mhz) aa = assembly location wl = wafer lot yy = year ww = work week g or = pb ? free package 6 pin clcc ln suffix case 848ab nbxdpa012 106.25/212.5 aawlyywwg nbxdpa012lnhtag clcc ? 6 (pb ? free) 100/ tape & reel
nbxdpa012 http://onsemi.com 2 fsel oe gnd clk v dd clk 1 2 3 6 5 4 figure 2. pin connections (top view) table 1. pin description pin no. symbol i/o description 1 ? inverted clock output. typically loaded with 100 receiver termination resistor across differential pair. receiver termination resistor across differential pair. 5% or 3.3 v 10%. table 2. output enable tri ? state function oe pin output pins open active high level active low level high z table 3. output frequency select fsel pin output frequency (mhz) open (pin will float high) 106.25 high level 106.25 low level 212.5 table 4. attributes characteristic value input default state resistor 170 k esd protection human body model machine model 2 kv 200 v meets or exceeds jedec standard eia/jesd78 ic latchup test 1. for additional moisture sensitivity information, refer to application note and8003/d. table 5. maximum ratings symbol parameter condition 1 condition 2 rating units v dd positive power supply gnd = 0 v 4.6 v i out lvds output current continuous surge 25 50 ma t a operating temperature range ? 40 to +85 c t stg storage temperature range ? 55 to +120 c t sol wave solder see figure 6 260 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability.
nbxdpa012 http://onsemi.com 3 table 6. dc characteristics (v dd = 2.5 v 5% or v dd = 3.3 v 10%, gnd = 0 v, t a = ? 40 c to +85 c) (note 2) symbol characteristic conditions min. typ. max. units i dd power supply current 85 105 ma v ih oe and fsel input high voltage 2000 v dd mv v il oe and fsel input low voltage gnd ? 300 800 mv i ih input high current oe fsel ? 100 ? 100 +100 +100 a i il input low current oe fsel ? 100 ? 100 +100 +100 a v od change in magnitude of v od for complementary output states (note 3) 0 1 25 mv v os offset voltage 1125 1375 mv v os change in magnitude of v os for complementary output states (note 3) 0 1 25 mv v oh output high voltage v dd = 2.5 v v dd = 3.3 v 1425 1600 mv v ol output low voltage v dd = 2.5 v v dd = 3.3 v 900 1075 mv v od differential output voltage 250 450 mv note: device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printe d circuit board with maintained transverse airflow greater than 500 ifpm. electrical parameters are guaranteed only over the declared operating temperature range. functional operation of the device exceeding these conditions is not implied. device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 2. measurement taken with outputs terminated with 100 ohm across differential pair. see figure 5. 3. parameter guaranteed by design verification not tested in production.
nbxdpa012 http://onsemi.com 4 table 7. ac characteristics (v dd = 2.5 v 5% or v dd = 3.3 v 10%, gnd = 0 v, t a = ? 40 c to +85 c) (note 4) symbol characteristic conditions min. typ. max. units f clkout output clock frequency fsel = high 106.25 mhz fsel = low 212.5 f frequency stability ? nbxdpa012 (note 5) 50 ppm noise phase ? noise performance 100 hz of carrier ? 112/ ? 105 dbc/hz f clkout = 106.25 mhz/212.5 mhz (see figures 3 and 4) 1 khz of carrier ? 123/ ? 11 6 dbc/hz 10 khz of carrier ? 131/ ? 124 dbc/hz 100 khz of carrier ? 131/ ? 124 dbc/hz 1 mhz of carrier ? 139/ ? 133 dbc/hz 10 mhz of carrier ? 161/ ? 158 dbc/hz t jit ( ) rms phase jitter 12 khz to 20 mhz 0.4 0.75 ps t jitter cycle to cycle, rms 1000 cycles 3 8 ps cycle to cycle, peak ? to ? peak 1000 cycles 7 35 ps period, rms 10,000 cycles 2 4 ps period, peak ? to ? peak 10,000 cycles 10 20 ps t oe/od output enable/disable time 200 ns t duty_cycle output clock duty cycle (measured at cross point) 48 50 52 % t r output rise time (20% and 80%) 115 400 ps t f output fall time (80% and 20%) 115 400 ps t start start ? up time 1 5 ms aging 1 st year 3 ppm every year after 1 st 1 ppm note: device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printe d circuit board with maintained transverse airflow greater than 500 ifpm. electrical parameters are guaranteed only over the declared operating temperature range. functional operation of the device exceeding these conditions is not implied. device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. measurement taken with outputs terminated with 100 ohm across differential pair. see figure 5. 5. parameter guarantees 10 years of aging. includes initial stability at 25 c, shock, vibration and first year aging.
nbxdpa012 http://onsemi.com 5 figure 3. typical phase noise plot at 106.25 mhz figure 4. typical phase noise plot at 212.5 mhz
nbxdpa012 http://onsemi.com 6 table 8. reliability compliance parameter standard method shock ? std ? 833, method 2002, condition b ? std ? 833, method 2003 ? std ? 833, method 2007, condition a ? std ? 202, method 215 ? std ? 203, method 210, condition i or j ? std ? 833, method 1001, condition a ? std ? 833, method 1004 figure 5. typical termination for output driver and device evaluation driver device receiver device clk d clk d z o = 50 z o = 50 100 nbxdpa012 260 217 175 150 temperature ( c) temp. 260 c 20 ? 40 sec. max. time 60 180 sec. 3 c/sec. max. cooling 6 c/sec. max. 60 150 sec. reflow peak pre ? heat ramp ? up figure 6. recommended reflow soldering profile
nbxdpa012 http://onsemi.com 7 package dimensions 6 pin clcc, 7x5, 2.54p case 848ab ? 01 issue c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. a b e d bottom view b e 6x 0.10 b 0.05 a c c 0.15 c terminal 1 indicator top view a a1 a3 0.10 c c seating plane side view l 6x 1 2 5 6 d3 dim a min nom max millimeters 1.70 1.80 1.90 a1 0.70 ref b 1.30 1.40 1.50 d1 6.17 6.20 6.23 d2 6.66 6.81 6.96 e1 4.37 4.40 4.43 r 0.70 ref l 1.17 1.27 1.37 a2 0.36 ref a3 0.08 0.10 0.12 d 7.00 bsc d3 5.08 bsc e 5.00 bsc e2 4.65 4.80 4.95 e3 3.49 bsc e 2.54 bsc d1 e1 d2 e2 a2 3 4 e3 r 4x *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* pitch 2.54 1.50 6x 5.06 1.50 6x dimension: millimeters h h 1.80 ref on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 nbxdpa012/d pureedge is a trademark of semiconductor components industries, llc (scillc). literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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